KAMTEK East Asia

PCB Capabilities:
Production Capacity: 35,000sqm/month (350,000sqft/month)
Min. Board Thickness: 0.40mm (16 mil)
Max. Board Thickness: 6.35mm (250 mil)
Max Single Unit Size: 457mm X 610mm (18"X 24")
Layer Count: 1 - 14 layers
Materials: CEM-1, FR-4, teflon(PTFE), aluminium substrates
Min Finished Hole Size: 0.25mm (10 mil)
Min Line Width/Space: 0.076mm (3 mil)
Min SMT Pitch: 0.30mm (12 mil)
Min Soldermask Bridge: 0.13mm (5 mil)
Copper Finish Thickness: 1oz - 4 oz
Aspect Ratio: 8:1
V-Cut: +/-0.13mm ( +/-5 mil) and skip scoring
Production Finishes:

Electroplated flash gold (hard and soft)
Electroless chemical gold (max 5 microinch thick)
Entek
HASL (30---1000u")
Gold Fingers (max 30 microinch thick)
Carbon Ink (<100 Ohm)

Impendance control testing +/-10%
LPI Soldermask
Peelable Soldermask
Vacuum Packaging

ISO9002 and QS9000 Approved
UL 94V-0 Approved
Build to IPC 600 Class II or customers specification
SPC (CPK > 1.33)

Special Teflon PCB Notes:
Layer Count: 1 - 2 layers, working on 4L
Normal stocked material: Roger and Taconic
Copper Thickness: 1 oz
Geltech GM1000 polyester material capability
Production Capacity: 5,000sqm/month (50,000sqft/month)
Thickness: 0.45 - 3.0mm (0.018 - 0.120")
Min. Line/Width Spacing: 0.13mm (5 mil)